LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Encapsulated,With specified encapsulant

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Anisotropic conductive sheet and printed circuit board

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Anti-reflective compositions comprising triazine compounds

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Apparatus for applying a semiconductor chip to a carrier...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Applications of smart polymer composites to integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Assembly including a circuit and an encapsulation frame, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Bow resistant plastic semiconductor package and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Ceramic coated plastic package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Chip package with transfer mold underfill

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Chip packaging compositions, packages and systems made...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Chip size package with stress relieving internal terminal

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

CMOS sensors having charge pushing regions

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Compositions for protecting semiconductor elements and semicondu

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Connection material

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Device packaging using heat spreaders and assisted deposition of

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Die structure using microspheres as a stress buffer for integrat

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Dual cure B-stageable underfill for wafer level

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Edge seal for integrated circuit chips