Packaged die on PCB with heat sink encapsulant
Packaged semiconductor device
Packaging integrated circuits for high stress environments
Packaging structure of SIP and a manufacturing method thereof
Partial underfill for flip-chip electronic packages
Passivated nanoparticles, method of fabrication thereof, and...
Photodetector sealing resin is a boride or an oxide of micro...
Photonic device and process for fabricating the same
Plastic ball grid array assembly
Plastic molded type electronic device
Plastic package type semiconductor device
Plastic-encapsulated semiconductor device
Polymer encapsulated electrical devices
Polymer encapsulated electrical devices
Potted hybrid integrated circuit