Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2000-07-26
2004-08-10
Nadav, Ori (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S787000, C257S792000
Reexamination Certificate
active
06774500
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a substrate for a semiconductor device, a semiconductor chip mounting substrate, a semiconductor device and method of fabrication thereof, and a circuit board, together with electronic equipment.
2. Description of Related Art
Methods have been developed for providing small packages such as chip scale/size packages (CSPs), which involve mounting a plurality of semiconductor chips on a flexible substrate then sealing the entire assembly in resin. The resultant sealed product is then cut into individual packages.
If the flexible substrate is cut by a blade or router in this case, a problem occurs in that the cutting generates dust at the corner portions of individual products, so a better solution is required.
SUMMARY OF THE INVENTION
To solve this problem, the present invention provides a substrate for a semiconductor device, a semiconductor chip mounting substrate, a semiconductor device and method of fabrication thereof, and a circuit board, together with electronic equipment comprising the same, wherein the generation of cutting dust is reduced.
(1) According to a first aspect of the present invention, there is provided a substrate for a semiconductor device, having a mounting region for a semiconductor chip, wherein at least one hole is formed at a position where cutting lines intersect.
The substrate for a semiconductor device in accordance with this invention can be cut apart to separate it into individual products that are semiconductor devices. The cutting is done along cutting lines. In practice, the cutting lines are of a striped form having a certain width. Corner portions of individual products are formed at positions where the cutting lines intersect.
With this aspect of the invention, “hole” is not limited to a through hole; it can also refer to any other type of hole that does not penetrate, such as a depression. If a hole is formed at each position where cutting lines intersect, part of the substrate for the semiconductor device forms an indented shape at each corner portion of each individual product. If a depression is formed at each position where cutting lines intersect, part of the substrate for the semiconductor device is made thinner at each corner portion of each individual product.
Since parts of the substrate for the semiconductor device are either indented inward or is thinner at the corner portions of the individual products, it is therefore possible to reduce the amount of cutting dust when the cutting is done.
(2) In this substrate for a semiconductor device, one of the holes may be formed at the position where the cutting lines intersect; and the hole may be formed to a size that comprises an intersection portion of the cutting lines.
This ensures that the corner portions of individual products are defined by inner wall surfaces of the holes or thinner portions formed by the provision of the depressions. Part of the substrate for the semiconductor device is formed to be indented inward or thinner at each corner portion of each individual product.
(3) In this substrate for a semiconductor device, a plurality of the holes may be formed at the position where the cutting lines intersect; and part of each of the holes may be superimposed on an intersection portion between the cutting lines.
This ensures that the corner portions of individual products are defined by inner wall surfaces of the holes or thinner portions formed by the provision of the depressions. Part of the substrate for the semiconductor device can be formed to be indented inward or thinner at each corner portion of each individual product.
Moreover, since it is sufficient that part of each hole is superimposed on the intersection portion between the cutting lines, each hole can be made smaller.
(4) In this substrate for a semiconductor device, the plurality of holes may be positioned on edges of one of the cutting lines that is to be cut last, in the intersection portion.
(5) In this substrate for a semiconductor device, the plurality of holes may be formed on part of the cutting line that is to be cut last, when that part is to be cut earlier than the intersection portion between the cutting lines.
(6) In this substrate for a semiconductor device, the plurality of holes may be formed on part of the cutting line that is to be cut last, when that part is to be cut after the intersection portion between the cutting lines.
(7) In this substrate for a semiconductor device, the spacing between one of the holes formed on an edge of the cutting line that is to be cut last and another of the holes formed on another edge of the cutting line may be less than the thickness of a cutting portion of a cutting tool.
This configuration ensures that the cutting can be done to cut away a part of each hole and that the corner portions of individual products can be defined by inner wall surfaces of the holes or thinner portions formed by provision of the depressions.
(8) In this substrate for a semiconductor device, at least one of the holes may be formed; and the hole may have an aperture portion that is closed by a cover.
This makes it possible to prevent the sealing resin from flowing into the hole, and thus prevent the sealing resin from seeping from one surface of the semiconductor device to the other surface thereof through the hole.
(9) In this substrate for a semiconductor device, an interconnecting pattern may be formed; and the cover may be formed of the same material as the interconnecting pattern.
This makes it possible to form the cover without increasing the steps of the fabrication process.
(10) According to a second aspect of the present invention, there is provided a semiconductor chip mounting substrate, comprising: a substrate of a material that can be cut into separate pieces, in which is formed at least one hole at an intersection portion between cutting lines for separating the substrate into a plurality of individual products; and a plurality of semiconductor chips which are mounted on the substrate.
The substrate in accordance with this aspect of the invention, on which is mounted a plurality of semiconductor chips, can be cut apart to form a plurality of individual products. The cutting is done along the cutting lines. In practice, the cutting lines are of a striped form having a certain width. Corner portions of individual products of the substrate are formed at positions where the cutting lines intersect.
With this aspect of the invention, “hole” is not limited to a through hole; it can also refer to any other type of hole that does not penetrate, such as a depression. If a hole is formed at each position where cutting lines intersect, each corner portion of each individual product of the substrate forms an indented shape. If a depression is formed at each position where cutting lines intersect, each corner portion of each individual product of the substrate is made thinner.
Since the corner portions of individual pieces of the substrate are either indented inward or are thinner, it is possible to reduce the amount of cutting dust even when the cutting is done along the intersecting cutting lines.
(11) In this semiconductor chip mounting substrate, the plurality of semiconductor chips may be sealed in by resin.
This configuration makes it possible to cut the resin apart simultaneously with the cutting of the substrate.
(12) In this semiconductor chip mounting substrate, the resin may fill the hole.
This provides resin in the intersection portion between cutting lines. If holes are formed in the substrate, each corner portion of the individual pieces of substrate and resin is formed by resin. If depressions are formed in the substrate, each corner portion of the individual pieces of substrate and resin is formed by a thinner piece of substrate and the resin.
(13) In this semiconductor chip mounting substrate, the hole may be formed to a size that comprises the intersection portion of the cutting lines.
(14) In this semiconductor chip mounting substrate, the hole may have an aperture portion tha
Nadav Ori
Seiko Epson Corporation
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