Die structure using microspheres as a stress buffer for integrat

Details Die structure using microspheres as a stress buffer for integrat Die structure using microspheres as a stress buffer for integrat

1998-12-15

2000-02-01

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257789, 257788, 257795, 257787, H01L 2329

Patent

active

060206489

ABSTRACT:
A process for packaging a die uses compressible microspheres to form a stress buffer layer between the die and an epoxy encapsulant to absorb stresses on the die caused by the different thermal expansion rates of the epoxy and die during temperature changes. By using a compressible layer of microspheres or other material, the need for a nitride passivation or other insulating layer to protect the die from thermally-induced stress is eliminated. In addition, the number and size of the microspheres and the amount of epoxy used to seal the package can be adjusted so that the epoxy is approximately co-planar with the top of the package to allow the package to be handled and used with standard equipment and processes.

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