Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2009-07-09
2011-10-25
Landau, Mathew (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S778000, C257S789000
Reexamination Certificate
active
08044524
ABSTRACT:
An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.
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International Search Report issued in corresponding application No. PCT/JP2008/050140, completed Apr. 3, 2008 and mailed Apr. 15, 2008.
Griffin & Szipl, P.C.
Hitachi Chemical Company Ltd.
Landau Mathew
Mitchell James M
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