Device packaging using heat spreaders and assisted deposition of

Details Device packaging using heat spreaders and assisted deposition of Device packaging using heat spreaders and assisted deposition of

1993-07-27

1998-12-08

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257790, 257796, H01L 2329

Patent

active

058474676

ABSTRACT:
A device or die is presented which uses laser deposited leads, with a filler to bridge the gap between the die and the lead frame. The filler may be oxide, poly amide, a combination of oxide layers and poly amide layers, plastic or a plastic which has plastic coated beads of metal. The die and lead frame are placed on a heat spreader. Leads are formed over the filler material from bond pads on the lead frame to bond pads on the die. Various protective materials are placed over the die to protect it from the package. Over the protective material is another heat spreader or other device that is required to make the die function better. Typical devices are batteries, capacitors, or other die. Finally, the structure is encapsulated in a package of non-conductive material. This structure is more stable than presently available structures because the active element, the die, is not in direct contact with the plastic package.

REFERENCES:
patent: 4882212 (1989-11-01), SinghDeo et al.
patent: 4888634 (1989-12-01), Lai et al.
patent: 4942456 (1990-07-01), Sako
patent: 4950427 (1990-08-01), Endo
patent: 5097317 (1992-03-01), Fujimoto et al.
patent: 5194933 (1993-03-01), Miyagi

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