Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2007-10-30
2007-10-30
Huynh, Andy (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S666000, C257S676000, C257S774000, C257SE23092, C257SE23066
Reexamination Certificate
active
11042740
ABSTRACT:
An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall that surrounds the at least one circuit component. A method of manufacturing the circuit board includes the step of attaching the substantially planar surface of the frame to the substrate in an arrangement in which the at least one circuit component is surrounded by a wall that defines the hole.
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Ruben David A.
Sleeper Scott B.
Tortorici Peter C.
Barry Carol F.
Bauer Steve
Huynh Andy
Medtronic Inc.
Soldner Michael C.
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