Barrier layer stack to prevent Ti diffusion
Barrier layers for conductive features
Barrier material for copper structures
Barrier material formation in integrated circuit structures
Barrier materials for metal interconnect in a semiconductor...
Barrier materials for semiconductor devices
Barrier metal integrity testing using a dual level line to...
Barrier metal layer
Barrier metal technology for tungsten plug interconnection
Barrier-less plug structure
Barrier-metal-free copper damascene technology using atomic...
Barrier-metal-free copper damascene technology using atomic...
Barrier-to-seed layer alloying in integrated circuit...
Base layer structure covering a hole of decreasing diameter in a
BEOL decoupling capacitor
BEOL decoupling capacitor
BEOL interconnect structures with improved resistance to stress
Bi-layer etch stop process for defect reduction and via...
Bias plasma deposition for selective low dielectric insulation
BICMOS semiconductor integrated circuit device and...