Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2007-02-20
2010-12-07
Vu, Hung (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S762000, C257S773000
Reexamination Certificate
active
07847402
ABSTRACT:
A chip is provided which includes a back-end-of-line (“BEOL”) interconnect structure. The BEOL interconnect structure includes a plurality of interlevel dielectric (“ILD”) layers which include a dielectric material curable by ultraviolet (“UV”) radiation. A plurality of metal interconnect wiring layers are embedded in the plurality of ILD layers. Dielectric barrier layers cover the plurality of metal interconnect wiring layers, the dielectric barrier layers being adapted to reduce diffusion of materials between the metal interconnect wiring layers and the ILD layers. One of more of the dielectric barrier layers is adapted to retain compressive stress while withstanding UV radiation sufficient to cure the dielectric material of the ILD layers, making the BEOL structure better capable of avoiding deformation due to thermal and/or mechanical stress.
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U.S. Appl. No. 11/162,666, filed Sep. 19, 2005.
Bonilla Griselda
Dimitrakopoulos Christos D.
Gates Stephen M.
Kim Jae H.
Lane Michael W.
Cai Yuanmin
Chartered Semiconductor Manufacturing Ltd
International Business Machines - Corporation
Neff Daryl
Samsung Electronics Co,. Ltd
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