Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2007-04-03
2007-04-03
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C174S250000, C361S767000, C257SE23020
Reexamination Certificate
active
10156016
ABSTRACT:
A printed circuit board (PCB) having a plurality of lands corresponding to a plurality of solder pins provided on a semiconductor chip package, the lands provided adjacent to the border of the printed circuit board having a rectangular shape elongated in a direction toward the border, thus providing a printed circuit board which can achieve a simple design, improve the integration of peripheral chips mounted thereon, and secure a fine soldering state.
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English Language Chinese Office Action for Chinese Patent Application No. 02122290.8, dated Feb. 27, 2004, (related to present application).
Staas & Halsey , LLP
Zarneke David A.
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