Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent
1995-04-14
1996-10-01
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
257782, H01L 2348, H01L 2352, H01L 2940
Patent
active
055613284
ABSTRACT:
A semiconductor chip having a number of bonding pads on one face is mounted on a set of matching, mirror-image bonding pads on a packaging substrate, in a flip chip configuration. An alignment template is formed on and permanently secured to the substrate, and takes the form of a frame surrounding the substrate bonding pads. The height of the template is sufficient to receive the edges of the chip and hold the chip in place while the assembly is being transported to the soldering operation. No alignment operation is required, since the chip is merely placed in the receptacle formed by the template. The template is of course aligned with the substrate bonding pads when the template is created. The template can be formed on the substrate using photolithographic techniques, and, preferably, the template itself is formed of a photo-definable material.
REFERENCES:
patent: 3191100 (1965-06-01), Sorvillo
patent: 3457639 (1969-07-01), Weller
patent: 3516155 (1970-06-01), Smith
patent: 3540121 (1970-11-01), Hutchinson et al.
patent: 3648121 (1972-03-01), Suenaga et al.
patent: 3931922 (1976-01-01), Jackson et al.
patent: 4371912 (1983-02-01), Guzik
patent: 4698662 (1987-10-01), Young et al.
patent: 4957882 (1990-09-01), Shinomiya
patent: 4979289 (1990-12-01), Dunaway et al.
patent: 5182632 (1993-01-01), Bechtel et al.
Loh William M.
Massingill Thomas J.
Clark S. V.
Crane Sara W.
Digital Equipment Corporation
Fisher Arthur W.
Maloney Denis G.
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