Pad over active circuit system and method with frame support...

Details Pad over active circuit system and method with frame support... Pad over active circuit system and method with frame support...

2003-07-31

2009-02-24

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S758000, C257S773000, C257S776000

Reexamination Certificate

active

07495343

ABSTRACT:
An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer may define a frame with an outer periphery and an inner periphery.

REFERENCES:
patent: 4636832 (1987-01-01), Abe et al.
patent: 4723197 (1988-02-01), Takiar et al.
patent: 4984061 (1991-01-01), Matsumoto
patent: 5027188 (1991-06-01), Owada et al.
patent: 5751065 (1998-05-01), Chittipeddi et al.
patent: 5773899 (1998-06-01), Zambrano
patent: 5965903 (1999-10-01), Chittipeddi et al.
patent: 5986343 (1999-11-01), Chittipeddi et al.
patent: 6016000 (2000-01-01), Moslehi
patent: 6037668 (2000-03-01), Cave et al.
patent: 6087732 (2000-07-01), Chittipeddi et al.
patent: 6100589 (2000-08-01), Tanaka
patent: 6144100 (2000-11-01), Shen et al.
patent: 6232662 (2001-05-01), Saran
patent: 6297562 (2001-10-01), Tilly
patent: 6313537 (2001-11-01), Lee et al.
patent: 6329712 (2001-12-01), Akram et al.
patent: 6358831 (2002-03-01), Liu et al.
patent: 6365970 (2002-04-01), Tsai et al.
patent: 6384486 (2002-05-01), Zuniga et al.
patent: 6400026 (2002-06-01), Andou et al.
patent: 6417087 (2002-07-01), Chittipeddi et al.
patent: 6448641 (2002-09-01), Ker et al.
patent: 6486051 (2002-11-01), Sabin et al.
patent: 6489228 (2002-12-01), Vigna et al.
patent: 6489688 (2002-12-01), Baumann et al.
patent: 6538326 (2003-03-01), Shimizu et al.
patent: 6552438 (2003-04-01), Lee et al.
patent: 6707156 (2004-03-01), Suzuki et al.
patent: 7453158 (2008-11-01), Singh et al.
Heinen, Gail et al., “Wire Bonds Over Active Circuits”, 1994, IEEE.
Chou, Kuo-Yu et al., “Active Circuits Under Wire Bonding I/O Pads in 0.13 μm Eight-Level Cu Metal, FSG Low-K Inter-Metal Dielectric CMOS Technology +”, Oct. 2001, IEEE.
Efland, T., et al., “LeadFrameOnChip offers Integrated Power Bus and Bond over Active Circuit”, 2001, International Symposium on Power Semiconductor Devices & ICs, Osaka.
Saran, Mukul et al., “Elimination of Bond-pad Damage Through Structural Reinforcement of Intermetal Dielectrics”, 1998, IEEE 36th Annual International Reliability Physics Symposium, Reno, Nevada.
Horng, Tzyy-Sheng, “A Rigorous Study of Wire-Bonding and Via-Hole Effects on GaAs Field Effect Transistors”, IEEE MTT-S Digest, 1995.
Office Action Summary from U.S. Appl. No. 10/633,004 which was mailed on Oct. 18, 2005.
Advisory Action from U.S. Appl. No. 10/633,004 which was mailed on Jul. 21, 2005.
Office Action Summary from U.S. Appl. No. 10/633,004 which was mailed on Mar. 22, 2005.
Office Action Summary from U.S. Appl. No. 10/633,004 which was mailed on Nov. 17, 2004.
Office Action Summary from U.S. Appl. No. 10/633,004 which was mailed on Aug. 6, 2004.
The Translation of The Antecedent Notification Of Rejection Reasons From Taiwanese Application No. 93114432.
Office Action Summary from U.S. Appl. No. 10/633,004 which was mailed on Mar. 17, 2006.
Office Action Summary from U.S. Appl. No. 11/046,420 which was mailed on Mar. 24, 2006.
Examiner's Answer from U.S. Appl. No. 11/067,551 which was mailed on Apr. 5, 2007.
Notice of Allowance form U.S. Appl. No. 10/633,004 which was mailed on Jul. 16, 2008.
Decision on Appeal from U.S. Appl. No. 10/633,004 which was mailed on Mar. 27, 2008.
Office Action Summary from U.S. Appl. No. 11/046,420 which was mailed on Sep. 6, 2006.

Affiliated with

Also associated with

Rating

Pad over active circuit system and method with frame support... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pad over active circuit system and method with frame support..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pad over active circuit system and method with frame support... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4069489