Pad over active circuit system and method with meshed...

Details Pad over active circuit system and method with meshed... Pad over active circuit system and method with meshed...

2003-07-31

2008-11-18

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S758000, C257S773000, C257S776000

Reexamination Certificate

active

07453158

ABSTRACT:
An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer is meshed.

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