BGA land pattern

Details BGA land pattern BGA land pattern

1996-02-23

2000-07-18

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

257738, 257773, 257774, 361760, 361772, H01L 2348, H01L 2352, H01L 2940

Patent

active

060911557

ABSTRACT:
A ball grid array (BGA) land pattern. In the present invention, a capture pad is disposed on a substrate. The capture pad is electrically coupled to a via which is formed into the substrate. A substantially rectangularly-shaped landing pad is also disposed on the substrate proximate to the capture pad. The substantially rectangularly-shaped landing pad is electrically coupled to the capture pad. In one embodiment, an electrically conductive connecting region electrically connects the substantially rectangularly-shaped landing pad to the capture pad. More specifically, the electrically conductive connecting region has a first end coupled to the capture pad and a second end coupled to the substantially rectangularly-shaped landing pad.

REFERENCES:
patent: 4878098 (1989-10-01), Saito et al.
patent: 5264729 (1993-11-01), Rostoker et al.

Affiliated with

Also associated with

Rating

BGA land pattern does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with BGA land pattern, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and BGA land pattern will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2039674