Ball grid array (BGA) integrated circuit packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

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Details

257780, 257779, 257691, 257693, H01L 2348, H01L 2352, H01L 2940

Patent

active

057961700

ABSTRACT:
An improved ball grid array (BGA) package having EMI shielding is provided. In a BGA package a thermally conductive heat spreader provided by a conductive layer, and an electrical interconnection is provided between the electrically conductive heat spreader and solder balls of the array, for example by plated through holes extending through the dielectric body of the package. Thus in use of the package, when contacts are made from the array of solder balls to a corresponding array of contact areas of a substrate, a ground connection is simultaneously provided to the heat spreader through the solder balls. For example, one or more conductive contacts on the substrate may be connected to a ground plane of the substrate, and a corresponding solder balls of the package are interconnected to the heat spreader. Beneficially, the ground connection is provided by external rows of solder balls of the array extending around sides of package, or by clusters of solder balls surrounding balls for carrying signals. Thus by providing integral ground connections, the heat spreader of the BGA package functions also a Faraday shield providing for improved shielding of electromagnetic interference.

REFERENCES:
patent: 4954877 (1990-09-01), Nakanishi et al.
patent: 5371404 (1994-12-01), Juskey

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