Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2011-01-11
2011-01-11
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S702000, C257S773000, C257SE23070
Reexamination Certificate
active
07868469
ABSTRACT:
An adapter board includes a package substrate having a first surface and a second surface and further including a board having wirings formed therein, pads disposed in the device side, and the pads disposed in the bump side, an insulating resin layer joined to the first surface, through holes formed in the positions corresponding to the pads in the insulating resin layer, vias formed in the through holes, and pads covering the through holes, wherein the pads are electrically coupled to the pads through the wirings, and the pads are electrically coupled to the pads through the vias.
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Japanese Office Action dated Aug. 18, 2009, with partial English translation.
Japanese Office Action dated May 11, 2010 (with partial English translation).
McGinn IP Law Group PLLC
Parekh Nitin
Renesas Electronics Corporation
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