Leadframe for a multi-chip package and method for...
Leadframe for an encapsulated optocomponent
Leadframe for integrated circuit package and method of manufactu
Leadframe having contact pads defined by a polymer insulating fi
Leadframe having secured outer leads, semiconductor device using
Leadframe including corner leads and semiconductor package...
Leadframe of a leadless flip-chip package and method for...
Leadframe strip having enhanced testability
Leadframe tip arrangement designing method
Leadframe with a chip pad for two-sided stacking and method...
Leadframe with encapsulant guide and method for the...
Leadframe with enhanced encapsulation adhesion
Leadframe, plastic-encapsulated semiconductor device, and...
Leadframe, resin-molded semiconductor device including the...
Leadframe-to-plastic lock for IC package
Leadframes for improved moisture reliability and enhanced...
Leadframes including offsets extending from a major plane...
Leadframes including offsets extending from a major plane...
Leadframes including offsets extending from a major plane...
Leadless integrated circuit package having standoff contacts...