Leadframe, plastic-encapsulated semiconductor device, and...

Details Leadframe, plastic-encapsulated semiconductor device, and... Leadframe, plastic-encapsulated semiconductor device, and...

2006-11-07

2006-11-07

Clark, Jasmine (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S620000, C438S111000, C257S666000, C257S670000, C257S674000, C257S675000, C257SE23031, C257SE23004

Reexamination Certificate

active

07132315

ABSTRACT:
An inventive leadframe includes an outer frame, a die pad, and a plurality of leads each having land portions and connections. The land portions each have an upper surface serving as a bonding pad to be connected with a metal wiring, and a lowermost part serving as an external terminal. The connections are each devoid of its lower part so as to be thinner than the land portion, and are provided between the outer frame and the land portions, between the land portions associated with each other in each lead, and between the land portions and the die pad. Furthermore, the inventive leadframe is provided with no member that functions as a suspension lead for connecting the outer frame and the die pad to each other during plastic encapsulation.

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