Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2005-03-15
2005-03-15
Whitehead, Jr., Carl (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
Reexamination Certificate
active
06867071
ABSTRACT:
A leadframe comprising a frame body having four peripheral sides, each adjacent pair of which collectively defines a frame corner. Disposed within a central space or opening defined by the frame body is a die paddle including four peripheral edge segments, each adjacent pair of which collectively define a paddle corner. The leadframe also includes a plurality of tie bars, each of which comprises a first portion extending from a respective paddle corner of the die paddle and a second portion which extends angularly from the first portion and perpendicularly into connection with one of the sides of the frame body. Connected to and extending from the sides of the frame body toward and in spaced relation to respective ones of the peripheral edge segments of the die paddle are a plurality of leads. Additionally, connected to and extending from the sides of the frame body in close proximity to respective ones of the frame corners are a plurality of corner leads. Each of the corner leads extends in spaced, generally parallel relation to at least one of the peripheral edge segments of the die paddle.
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Jang Sung Sik
Lee Choon Heung
Yoo Su Yol
Amkor Technology Inc.
Harrison Monica D.
Jr. Carl Whitehead
Stetina Brunda Garred & Brucker
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