Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-03-07
2006-03-07
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S015000, C438S111000, C257S666000
Reexamination Certificate
active
07008825
ABSTRACT:
A method of fabricating a semiconductor package comprising the step of providing a leadframe strip which defines a strip plane and a multiplicity of leadframes. Each of the leadframes includes an outer frame defining a central opening and a die pad disposed within the central opening. Each leadframe further includes a plurality of leads which are attached to the outer frame and extend toward the die pad in spaced relation to each other. The outer frames are integrally connected to each other and collectively define connecting bars which extend in multiple rows and columns and define saw streets. Semiconductor dies are attached to respective ones of the die pads, with the semiconductor dies being mechanically and electrically connected to the leads of respective ones of the leadframes. Thereafter, an encapsulant material is applied to the leadframe strip to form at least one mold cap which at least partially encapsulates the leadframes, the semiconductor dies, and the conductive wires. The leadframe strip and the mold cap collectively define a package strip. Isolation cuts are formed through the package strip along at least some of the saw streets to effectively electrically isolate the leadframes from each other.
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Alabin Leocadio M.
Bancod Ludovico E.
Davis Terry W.
Kent Ian
Amkor Technology Inc.
Jr. Carl Whitehead
Mitchell James M.
Stetina Brunda Garred & Brucker
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