Leadframe with enhanced encapsulation adhesion

Details Leadframe with enhanced encapsulation adhesion Leadframe with enhanced encapsulation adhesion

2006-10-24

2006-10-24

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S107000, C257S666000

Reexamination Certificate

active

07125750

ABSTRACT:
A leadframe having a metallic substrate and comprising layers of plated material, and a method of manufacturing said leadframe are provided. The substrate is plated with a layer of oxidizable material comprising nickel and a noble metal is selectively plated on the layer of oxidizable material. Thereafter, an exposed portion of the oxidizable material that is not plated with the noble metal is passivated to enhance adhesion of an encapsulation compound molded to the leadframe.

REFERENCES:
patent: 4946518 (1990-08-01), Spanjer et al.
patent: 5459103 (1995-10-01), Kelleher et al.
patent: 5916696 (1999-06-01), Abys et al.
patent: 91308157.6 (1991-09-01), None

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