Leadframe with a chip pad for two-sided stacking and method...

Details Leadframe with a chip pad for two-sided stacking and method... Leadframe with a chip pad for two-sided stacking and method...

2006-09-05

2006-09-05

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

active

07101733

ABSTRACT:
A leadframe with a chip pad for two-sided stacking including a chip pad and a plurality of leads is disclosed. A dielectric adhesive layer is formed on the lower surface of the chip pad and is adhered onto a first trace layer, which has a connecting pad. At least a through hole passes through the chip pad, the dielectric adhesive layer and the first trace layer. An electrically-conductive material is formed inside the through hole for electrically connecting the connecting pad of the first trace layer to the chip pad. When an electronic component is mounted on the lower surface of the chip pad, a plurality of bonding wires having one ends on the upper surface of the chip pads can electrically connect the electronic component to the leads for achieving two-sided stacking of the chip pad.

REFERENCES:
patent: 6544812 (2003-04-01), Camenforte et al.
patent: 6872591 (2005-03-01), Wang et al.
patent: 6908788 (2005-06-01), Lin
patent: 6913949 (2005-07-01), Pflughaupt et al.

Affiliated with

Also associated with

Rating

Leadframe with a chip pad for two-sided stacking and method... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadframe with a chip pad for two-sided stacking and method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadframe with a chip pad for two-sided stacking and method... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3584484