Leadframe having secured outer leads, semiconductor device using

Details Leadframe having secured outer leads, semiconductor device using Leadframe having secured outer leads, semiconductor device using

1996-07-29

1998-08-04

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438112, H01L 2140

Patent

active

057892806

ABSTRACT:
A method of making a leadframe and a semiconductor device using the leadframe. The leadframe has a plurality of outer leads. Linking isolation members are located in the direction crossing to the extension direction of the outer leads so as to connect the neighboring outer leads with each other.

REFERENCES:
patent: 5104827 (1992-04-01), Schneider et al.
patent: 5258331 (1993-11-01), Masumoto et al.
patent: 5286680 (1994-02-01), Cain
patent: 5378656 (1995-01-01), Kajihara et al.
patent: 5410804 (1995-05-01), Berendts
patent: 5429992 (1995-07-01), Abbott et al.
patent: 5633205 (1997-05-01), Tsuchiya et al.

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