Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1996-02-23
1998-07-07
Niebling, John
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438121, H01L 2160
Patent
active
057768013
ABSTRACT:
A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided. Pads on a chip are wire bonded to these contact pads on the leadframe. The first portion is encapsulated in a molded package. The structure inhibits silver migration, provides insulation between wires and leadframe, and provides improved adhesion between plastic package and leadframe. A single insulating film with openings for providing the contact pads provides all these features.
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Carper James L.
Irish Gary H.
Jackson Robert L.
Rieley Sheldon C.
Smith Robert M.
International Business Machines - Corporation
Leas James M.
Niebling John
Turner Kevin F.
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