Leadless integrated circuit package having standoff contacts...

Details Leadless integrated circuit package having standoff contacts... Leadless integrated circuit package having standoff contacts...

2009-03-09

2010-12-28

Luu, Chuong A. (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S109000, C438S123000

Reexamination Certificate

active

07858443

ABSTRACT:
A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.

REFERENCES:
patent: 6238952 (2001-05-01), Lin
patent: 6498099 (2002-12-01), McLellan et al.
patent: 6700188 (2004-03-01), Lin
patent: 7049177 (2006-05-01), Fan et al.
patent: 2001024135 (2001-01-01), None
patent: 2005317998 (2005-11-01), None
patent: 2007048981 (2007-02-01), None

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