Leadframe with encapsulant guide and method for the...

Details Leadframe with encapsulant guide and method for the... Leadframe with encapsulant guide and method for the...

2005-04-14

2008-03-04

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S123000, C438S106000, C438S127000, C257S676000, C257S666000, C257SE23031, C257SE23061, C257SE23046, C257SE23043

Reexamination Certificate

active

07338841

ABSTRACT:
A method for fabricating a leadframe with encapsulant guide is provided, including forming a die attach paddle. Leads are formed around at least portions of the die attach paddle, and encapsulant guides are formed angled on a plurality of the leads to push the leads outwardly when an encapsulant flows therepast.

REFERENCES:
patent: 5239131 (1993-08-01), Hoffman et al.
patent: 5939775 (1999-08-01), Bucci et al.
patent: 6424024 (2002-07-01), Shih et al.
patent: 6448633 (2002-09-01), Yee et al.
patent: 6627976 (2003-09-01), Chung et al.
patent: 6800507 (2004-10-01), Kasuga et al.
patent: 6847099 (2005-01-01), Bancod et al.
patent: 6894376 (2005-05-01), Mostafazadeh et al.

Affiliated with

Also associated with

Rating

Leadframe with encapsulant guide and method for the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadframe with encapsulant guide and method for the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadframe with encapsulant guide and method for the... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3967874