Alignment mark and method for manufacturing a semiconductor...

Alignment mark and method for manufacturing a semiconductor...

Alignment targets having enhanced contrast

Apparatus for cleaving laser bars

Automated combi deposition apparatus and method

Back-side wafer singulation method

Bond pad for wafer and package for CMOS imager

Breakable tethers for microelectromechanical system devices...

Compound semiconductor device and method of manufacturing...

Crack stop trenches

Crack stops

Crackstop structures and methods of making same

Deep alignment marks on edge chips for subsequent alignment...

Deterministic generation of an integrated circuit...

Dicing die-bonding film

Dicing die-bonding film

Dicing method

Dicing method and dicing apparatus for dicing plate-like...

Dicing process for GAAS/INP and other semiconductor materials

Diffusion region routing for narrow scribe-line devices