Back-side wafer singulation method

Details Back-side wafer singulation method Back-side wafer singulation method

2005-03-22

2005-03-22

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S401000, C257S797000

Reexamination Certificate

active

06869861

ABSTRACT:
A wafer includes a vertical scribe line and a horizontal scribe line on a front-side surface of the wafer. An intersection of the vertical scribe line and the horizontal scribe line is optically recognized through a wafer support attached to the front-side surface of the wafer. The wafer is drilled all the way through at the intersection to form a back-side alignment mark on a back-side surface of said wafer. The back-side alignment mark is used to aligning a saw, which singulates the wafer from the back-side surface.

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