Dicing die-bonding film

Details Dicing die-bonding film Dicing die-bonding film

2007-11-29

2008-09-30

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S401000, C438S110000, C438S113000, C438S458000, C438S114000, C257S797000, C257S620000, C257SE23179, C257SE21596, C257SE21599

Reexamination Certificate

active

07429522

ABSTRACT:
A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is possible to provide a dicing die-bonding film in which in the case a semiconductor wafer and the dicing die-bonding film are stuck onto each other, the position of the die-bonding adhesive layer in the film can be recognized.

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