Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate
2011-03-29
2011-03-29
Chu, Chris (Department: 2815)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Having specified scribe region structure
C438S113000, C438S401000, C438S975000, C257SE21523, C257S620000, C257S797000, C430S319000
Reexamination Certificate
active
07915141
ABSTRACT:
The generation of an identification number of a chip supporting at least one integrated circuit, including the step of causing a cutting of at least one conductive section by cutting of the chip among several first conductive sections parallel to one another and perpendicular to at least one edge of the chip, the first sections being individually connected, by at least one of their ends, to the chip, and exhibiting different lengths, the position of the cutting line with respect to the chip edge conditioning the identification number.
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Chu Chris
Graybeal Jackson LLP
Jablonski Kevin D.
Jorgenson Lisa K.
STMicroelectronics SA
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