Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Patent
1998-11-20
2000-06-13
Bowers, Charles
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Having specified scribe region structure
438460, 438461, H01L 2146
Patent
active
060749342
ABSTRACT:
A method and apparatus are provided for automated cleaving of semiconductor laser bars into laser devices. The structures to be cleaved are sandwiched between two sheets of plastic film and, while supported on a stabilizing surface, are transported between the sheets in a direction perpendicular to scribe marks defining the sides of the laser devices. At one point, the film sheets with the structures between them pass over a raised breaker assembly on the stabilizing surface. A high pressure air source above the breaker assembly provides a blast of air towards each film sheet enclosed structure as it passes over the breaker assembly. This causes the structure to fracture or cleave along the scribe line. As the film sheet pass over the breaker assembly, the structure is cleaved at each successive scribe line. Thus, downstream of the breaker assembly, there are provided a series of separated devices between the two film sheets. Moreover, there is no possibility that the devices will be displaced as a result of any air currents, since they are securely retained between the two film sheets.
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Dautartas Mindaugas Fernand
Freund Joseph Michael
Gault William Andrew
Geary John Michael
Przybylek George John
Bowers Charles
Lucent Technologies - Inc.
Schillinger Laura M
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