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Flex chip connector for semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Flexible diode package and method of manufacturing

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Flip chip chip-scale package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Flip chip molded/exposed die process and package structure

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Flip chip on lead frame

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Flip clip attach and copper clip attach on MOSFET device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Flip-chip on flex for high performance packaging applications

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Flip-chip on lead frame

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Flipchip QFN package and method therefor

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Floating gate field effect transistors for chemical and/or...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Fluxless die-to-heat spreader bonding using thermal...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Folded frame carrier for MOSFET BGA

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Forming microelectronic connection components by...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Glass/Metal package and method for producing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Gold spot plated leadframes for semiconductor devices and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Ground plane for exposed package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Hardened Fe-Ni alloy for the manufacture of integrated...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Heat assembly and method of transferring heat

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Heat conductive molded body and manufacturing method thereof...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Heat dissipating package structure and method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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