Glass/Metal package and method for producing the same

Details Glass/Metal package and method for producing the same Glass/Metal package and method for producing the same

1996-08-28

1999-03-02

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438121, 438125, H01L 2144

Patent

active

058770429

ABSTRACT:
A method of producing a glass/metal package where a glass portion of the package is built up around a provided leadframe (10) using applications of solderable and glass pastes (20) which are subsequently fired (30). The glass paste and leadframe are chosen to have similar coefficients of expansion and the leadframe is pretreated to degasify and control oxidation of the metal to promote glass adhesion to the leadframe and prevent microcracking at a glass/metal interface. A seal ring is applied to the glass paste (40) and a lid is attached to the seal ring (50). The package is used to provide an sealed inert internal environment for sensitive electronic components such as a piezoelectric element. The package may be configured for leaded or surface mounting (60).

REFERENCES:
patent: 5120678 (1992-06-01), Moore et al.
patent: 5168344 (1992-12-01), Ehlert et al.
patent: 5217922 (1993-06-01), Akasaki et al.
patent: 5219794 (1993-06-01), Satoh et al.
patent: 5431718 (1995-07-01), Lombard et al.
patent: 5598031 (1997-01-01), Groover et al.
patent: 5744752 (1998-04-01), McHerron et al.
patent: 5750926 (1998-05-01), Scholman et al.
patent: 5756380 (1998-05-01), Berg et al.

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