Flip chip on lead frame

Details Flip chip on lead frame Flip chip on lead frame

2005-10-11

2005-10-11

Nguyen, Ha (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S108000

Reexamination Certificate

active

06953711

ABSTRACT:
There is disclosed a flip-chip-type method of assembling semiconductor devices. A one-step encapsulation process promotes adhesion of the die to the lead fingers and prevents the potential of shorts developing between the adjacent bumps or lead fingers. Conventional mold compound is used to reduce localized stress caused by coefficient of thermal expansion (CTE) mismatch between the die and substrate, or the lead frame.

REFERENCES:
patent: 5817540 (1998-10-01), Wark
patent: 6482680 (2002-11-01), Khor et al.
patent: 6648213 (2003-11-01), Patterson et al.
patent: 6661087 (2003-12-01), Wu
patent: 6700187 (2004-03-01), Paek
patent: 6717068 (2004-04-01), Motonishi et al.
patent: 6846704 (2005-01-01), Paek

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