Gold spot plated leadframes for semiconductor devices and...

Details Gold spot plated leadframes for semiconductor devices and... Gold spot plated leadframes for semiconductor devices and...

2006-12-12

2006-12-12

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S612000

Reexamination Certificate

active

07148085

ABSTRACT:
A leadframe for use with integrated circuit chips comprising a plated layer of gold selectively covering areas of said leadframe intended for solder attachment; and said gold layer providing a visual distinction to said areas.

REFERENCES:
patent: 3819497 (1974-06-01), Grunwald et al.
patent: 4137546 (1979-01-01), Frusco
patent: 4754317 (1988-06-01), Comstock et al.
patent: 5198964 (1993-03-01), Ito et al.
patent: 5234866 (1993-08-01), Okinaga et al.
patent: 5360991 (1994-11-01), Abys et al.
patent: 5521432 (1996-05-01), Tsuji et al.
patent: 5554569 (1996-09-01), Ganesan et al.
patent: 5675177 (1997-10-01), Abys et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5801436 (1998-09-01), Serizawa
patent: 5935719 (1999-08-01), Abbott
patent: 5946556 (1999-08-01), Hashizume
patent: 5958607 (1999-09-01), Kim et al.
patent: 5994767 (1999-11-01), Huang et al.
patent: 6078104 (2000-06-01), Sakurai
patent: 6087712 (2000-07-01), Kim et al.
patent: 6150711 (2000-11-01), Kom et al.
patent: 6159775 (2000-12-01), Kazuto et al.
patent: 6194777 (2001-02-01), Abbott et al.
patent: 6232651 (2001-05-01), Lee et al.
patent: 6245448 (2001-06-01), Abbott
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6287896 (2001-09-01), Yeh et al.
patent: 6306685 (2001-10-01), Liu et al.
patent: 6358772 (2002-03-01), Miyoshi
patent: 6358778 (2002-03-01), Shinohara
patent: 02-234833 (1992-04-01), None
patent: 2000-77593 (2000-03-01), None

Affiliated with

Also associated with

Rating

Gold spot plated leadframes for semiconductor devices and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Gold spot plated leadframes for semiconductor devices and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gold spot plated leadframes for semiconductor devices and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3719026