Backside failure analysis capable integrated circuit packaging
Backside metallization on microelectronic dice having...
Backside metallization on microelectronic dice having...
Backside metallization on sides of microelectronic dice for...
Ball grid array module
Ball grid array package and process for manufacturing same
Ball grid array package and process for manufacturing same
Ball grid array package stacking system
BGA package for high density cavity-up wire bond device...
Bonding support for leads-over-chip process
Bumped chip carrier package using lead frame and method for...
Bumpless flip chip assembly with strips and via-fill
Bumpless flip chip assembly with strips-in-via and plating