Folded frame carrier for MOSFET BGA

Details Folded frame carrier for MOSFET BGA Folded frame carrier for MOSFET BGA

2005-07-12

2008-07-22

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S121000, C438S122000, C257S666000, C257S676000, C257SE23031, C257SE23059

Reexamination Certificate

active

07402462

ABSTRACT:
A folded frame carrier has a die attach pad (DAP)30and one or more folded edges32, 33, 34, 35. Each folded edge has one or more studs36and each stud has a trapezoidal tip. The folded frame carrier may be made of single gauge copper or copper alloy. Multiple folded frame carriers may be formed between opposite rails of a lead frame. The folded edges are cut with a relief groove. The tips are formed in edges of the DAP and then the tips are folded upright. The tips provide electrical connection to the terminal on the rear surface of a power semiconductor mounted on the DAP.

REFERENCES:
patent: 6133634 (2000-10-01), Joshi
patent: 6784537 (2004-08-01), Moriguchi
patent: 6879033 (2005-04-01), Hosoya
patent: 6893901 (2005-05-01), Madrid
patent: 7122884 (2006-10-01), Cabahug et al.
patent: 2002/0167075 (2002-11-01), Madrid

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