Flipchip QFN package and method therefor

Details Flipchip QFN package and method therefor Flipchip QFN package and method therefor

2005-03-15

2005-03-15

Lee, Eddie (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000

Reexamination Certificate

active

06867072

ABSTRACT:
A semiconductor device (10) includes a first leadframe (18) having a perimeter (20) that defines a cavity (22) and leads (14) extending inwardly from the perimeter, and a second leadframe (32) having top and bottom surfaces and a die paddle surrounding a die receiving area (36). An integrated circuit (12) is placed within the die receiving area of the second leadframe. The IC has bonding pads (44) located on a peripheral portion of its top surface. The second leadframe and the IC are in facing relation with the first leadframe such that the leads of the first leadframe are electrically connected to respective ones of the bonding pads. A mold compound (50) is injected between the first and second leadframes and covers the second leadframe top surface and a central area of the first surface of the IC. At least the bottom surfaces of the leads are exposed.

REFERENCES:
patent: 4809135 (1989-02-01), Yerman
patent: 4894752 (1990-01-01), Murata et al.
patent: 5157480 (1992-10-01), McShane et al.
patent: 5172214 (1992-12-01), Casto
patent: 5200362 (1993-04-01), Lin et al.
patent: 5262674 (1993-11-01), Banerji et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5625235 (1997-04-01), Takiar
patent: 6211462 (2001-04-01), Carter et al.
patent: 6376905 (2002-04-01), Hisano et al.
patent: 6396130 (2002-05-01), Crowley et al.
patent: 6501156 (2002-12-01), Nakanishi et al.

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