Package for high frequency usages and its manufacturing method

Package for solid state image sensing device and method for manu

Packaged integrated circuit with enhanced thermal dissipation

Packaged microelectronic components

Packaged semiconductor with coated leads and method therefore

Packaging method for an electronic element

Packaging method for segregating die paddles of a leadframe

Paddleless molded plastic semiconductor chip package

Palladium-spot leadframes for high adhesion semiconductor...

Partially patterned lead frames and methods of making and...

PBGA stiffener package

PBGA substrate for anchoring heat sink

Photosensitive resin composition

Physical quantity sensor, lead frame, and manufacturing...

Plastic encapsulated semiconductor device and method of manufact

Plastic lead frames for semiconductor devices, packages...

Plastic molded type semiconductor device and fabrication...

Plastic overmolded packages with mechancially decoupled lid...

Plastic package with exposed die and method of making same

Plated leadframes with cantilevered leads