Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2005-01-11
2008-12-09
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S414000, C438S048000, C438S049000, C438S056000, C438S257000
Reexamination Certificate
active
07462512
ABSTRACT:
Specific ionic interactions with a sensing material that is electrically coupled with the floating gate of a floating gate-based ion sensitive field effect transistor (FGISFET) may be used to sense a target material. For example, an FGISFET can use (e.g., previously demonstrated) ionic interaction-based sensing techniques with the floating gate of floating gate field effect transistors. The floating gate can serves as a probe and an interface to convert chemical and/or biological signals to electrical signals, which can be measured by monitoring the change in the device's threshold voltage, VT.
REFERENCES:
Bausells et al. “Ion-sensitive transistors fabricated in a commercial CMOS technology”, Sensors and Actuators B vol. 57, (1999) pp. 56-62.
Janata, J. “Potentiometric Microsensors”, Chemical Reviews vol. 90 (1990) pp. 691-703.
Levon Kalle
Rahman Arifur
Sai Tsunehiro
Zhao Ben
Jr. Carl Whitehead
McCall Sonya D
Pokotylo John C.
Polytechnic University
Straub & Pokotylo
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