Flexible diode package and method of manufacturing

Details Flexible diode package and method of manufacturing Flexible diode package and method of manufacturing

2011-08-23

2011-08-23

Lee, Cheung (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S106000, C438S124000, C438S125000, C257SE21499, C257SE21500, C257SE21506

Reexamination Certificate

active

08003446

ABSTRACT:
A single step packaging process that both melts a solder and also cures an adhesive about a microelectronic circuit. The process finds technical advantages by simplifying packaging of a die that may be coupled to a planar flexible lead, which leads to a lower production cost and quicker manufacturing time. The planar flexible lead may be adapted to bend and flex during mechanical stress and during extreme temperature cycling, and allow direct mounting of the device to a member by easily welding or soldering. The invention may comprise a flexible solar cell diode that can be closely positioned on solar panels at an extremely low cost.

REFERENCES:
patent: 2005/0167821 (2005-08-01), Mamitsu et al.

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