Aluminum-copper bond pad design and method of fabrication
Aluminum-filled via structure with barrier layer
Aluminum-palladium alloy for initiation of electroless plating
Aluminum/copper clad interconnect layer for VLSI applications
Amine-free deposition of metal-nitride films
Ammonia passivation of metal gate electrodes to inhibit...
Ammonium chloride vaporizer cold trap
Amorphous carbon-based non-volatile memory
Amorphous silicon gate with mismatched grain-boundary microstruc
Angled implant in a fabrication technique to improve...
Anneal hillock suppression method in integrated circuit...
Anneal sequence for high-&kgr; film property optimization
Annealed poly-silicide etch process
Annealing ambient in integrated circuit interconnects
Anti-agglomeration of copper seed layers in integrated...
Anti-corrosion etch process for etching metal interconnections e
Anti-fuse device structure and electroplating circuit...
Anti-oxidation layer formation by carbon incorporation
Anti-reflection film and method of manufacturing
Anti-reflective coating doped with carbon for use in...