Ammonium chloride vaporizer cold trap

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

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Details

438905, 438958, 438963, 438791, 118715, 118724, H01L 2144, H01L 2131, B05C 1100, C23C 1600

Patent

active

061071986

ABSTRACT:
The present invention comprises means for sublimating and handling ammonium chloride (NH.sub.4 Cl) vapor, a bi-product of a silicon nitride growth process, thereby preventing backstreaming into the reactor and ingestion of vapor and particulates by the vacuum pump. The exhaust circuit comprises a novel combination of valves, sublimation and cold traps, cooling and heating elements to facilitate reduction of condensed NH.sub.4 Cl volume from a first path trap thus reducing maintenance, increasing production up-time and enhancing product yield.

REFERENCES:
patent: 4168741 (1979-09-01), Degenhardt et al.
patent: 5015503 (1991-05-01), Varrin, Jr. et al.
patent: 5250323 (1993-10-01), Miyazaki
patent: 5261963 (1993-11-01), Basta et al.
patent: 5536319 (1996-07-01), Wary et al.
patent: 5584963 (1996-12-01), Takahashi
patent: 5788747 (1998-08-01), Horiuchi et al.
patent: 5888579 (1999-03-01), Lun

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