Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1998-03-26
2000-08-22
Niebling, John F.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438905, 438958, 438963, 438791, 118715, 118724, H01L 2144, H01L 2131, B05C 1100, C23C 1600
Patent
active
061071986
ABSTRACT:
The present invention comprises means for sublimating and handling ammonium chloride (NH.sub.4 Cl) vapor, a bi-product of a silicon nitride growth process, thereby preventing backstreaming into the reactor and ingestion of vapor and particulates by the vacuum pump. The exhaust circuit comprises a novel combination of valves, sublimation and cold traps, cooling and heating elements to facilitate reduction of condensed NH.sub.4 Cl volume from a first path trap thus reducing maintenance, increasing production up-time and enhancing product yield.
REFERENCES:
patent: 4168741 (1979-09-01), Degenhardt et al.
patent: 5015503 (1991-05-01), Varrin, Jr. et al.
patent: 5250323 (1993-10-01), Miyazaki
patent: 5261963 (1993-11-01), Basta et al.
patent: 5536319 (1996-07-01), Wary et al.
patent: 5584963 (1996-12-01), Takahashi
patent: 5788747 (1998-08-01), Horiuchi et al.
patent: 5888579 (1999-03-01), Lun
Hung Cheng-Chang
Lin Wei-Farn
Ackerman Stephen B.
Nguyen Ha Tran
Niebling John F.
Saile George O.
Vanguard International Semiconductor Corporation
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