Recessed metal lines for protective enclosure in integrated...

Recessed tape and method for forming a BGA assembly

Recipe design to prevent tungsten (W) coating on wafer...

Recovery processing method of an electrode

Rectangular contact used as a low voltage fuse element

Redistribution layer with microstrips

Redistribution process

Reduced cross-contamination between chambers in a...

Reduced dry etching lag

Reduced electromigration and stressed induced migration of...

Reduced fluorine contamination for tungsten CVD

Reduced leakage interconnect structure

Reduced metal pipe formation in metal silicide contacts

Reduced RC delay between adjacent substrate wiring lines

Reduced splattering of unpassivated laser fuses

Reduced temperature contact/via filling

Reduced wafer warpage in semiconductors by stress...

Reducing copper line resistivity by smoothing trench and via...

Reducing damage to ulk dielectric during cross-linked...

Reducing reflectivity on a semiconductor wafer by annealing alum