Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-02-15
2005-02-15
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S613000, C438S614000, C438S616000
Reexamination Certificate
active
06855623
ABSTRACT:
A system for attaching a plurality of solder balls to an electronic device is disclosed. The system includes, in one embodiment, a heat-resistant tape having a first side comprising a plurality of recesses. The first side of the tape may form an adhesive surface. The recesses are located for registration with a plurality of connection points on the electronic device. The recesses are each adapted to receive and retain a solder ball therein. After placing a solder ball within two or more of the recesses, the first side of the tape may be adhered to the electronic device with the solder balls retained therein. Heating of the solder balls causes them to reflow and adhere to the connection points. After cooling, the tape may be removed, wherein the solder balls remain bonded to the connection points, forming a Ball Grid Array (BGA).
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“SolderQuik (tm) Ball Grid Array (BGA) Preforms”, http://www.winslowautomation.com/bga.htm, Winslow Automation, Inc., 3 pages.
Akiyama, S..,et al., “Continuous Formation of CoCr Films on Pen Tape by Facing Targets Sputtering”,IEEE Transactions on Magnetics, 25, (Sep. 1989),4189-4191.
Jr. Carl Whitehead
Micro)n Technology, Inc.
Mitchell James
Schwegman Lundberg Woessner & Kluth P.A.
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