Recovery processing method of an electrode

Details Recovery processing method of an electrode Recovery processing method of an electrode

2005-06-14

2005-06-14

Whitehead, Jr., Carl (Department: 2829)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

06905952

ABSTRACT:
While a transfer surface10aof a transfer plate10having a predetermined surface roughness is brought into contact with a plurality of bumps44B on a contact sheet44formed on a substrate44M having the coefficient of linear expansion larger than that of the transfer plate10at a predetermined pressure, the substrate44M and the transfer plate10are heated to a predetermined temperature to recover the surface roughness of the bump44B to a predetermined value.

REFERENCES:
patent: 90104620.5 (1991-01-01), None
patent: 0415896 (1991-03-01), None
patent: 8-96865 (1996-04-01), None
patent: 2000-294043 (2000-10-01), None
Office Action from Chinese Patent Office in Patent Application No. 031384099, dated Oct. 29, 2004.

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