Unique .alpha.-C:N:H/.alpha.-C:N.sub.x film liner/barrier to pre
Use of a biased precoat for reduced first wafer defects in...
Use of a plasma source to form a layer during the formation...
Use of cyclic siloxanes for hardness improvement of low k...
Use of enhanced turbomolecular pump for gapfill deposition...
Use of fluorine implantation to form a charge balanced...
Use of inductively-coupled plasma in plasma-enhanced...
Use of linear injectors to deposit uniform selective ozone...
Use of linear injectors to deposit uniform selective ozone...
Use of linear injectors to deposit uniform selective ozone...
Use of multifunctional si-based oligomer/polymer for the...
Use of phoslon (PNO) for borderless contact fabrication,...
Use of selective ozone TEOS oxide to create variable...
Using H2anneal to improve the electrical characteristics of...
Using polydentate ligands for sealing pores in low-k...
UV cure process and tool for low k film formation
UV pretreatment process for ultra-thin oxynitride formation
Variable flow deposition apparatus and method in...
Variable stoichiometry silicon nitride barrier films for...
Varying TEOS flow rate while forming intermetallic insulating la