4. Active solid-state devices (e.g., transistors, solid-state diode
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Stack package having pattern die redistribution

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stack package made of chip scale packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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stack package made of chip scale packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stack package of semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Stack package using anisotropic conductive film (ACF) and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stack package using flexible double wiring substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stack package utilizing through vias and re-distribution lines

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stack package with vertically formed heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Stack package, a method of manufacturing the stack package,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stack resistor structure for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With thin active central semiconductor portion surrounded by...
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Stack semiconductor chip package and lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Stack semiconductor package including an interposer chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Stack structure of circuit board with semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stack structure of semiconductor packages and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stack structure with semiconductor chip embedded in carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stack type ball grid array package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stack type ball grid array package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stack type flip-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stack type flip-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stack type package module and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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