Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2007-05-31
2010-02-02
Nguyen, Cuong Q (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S686000
Reexamination Certificate
active
07656040
ABSTRACT:
A stack structure of circuit boards embedded with semiconductor components therein is proposed, which includes at least two semiconductor components embedded circuit boards, a plurality of conductive bumps, and at least one adhesive layer. The circuit boards are each formed with a circuit layer having a plurality of electrical connection pads. The conductive bumps are formed on the electrical connection pads of at least one of the circuit boards. The adhesive layer is formed between the circuit boards such that a portion of the adhesive layer between the conductive bumps and the electrical connection pads, or between the opposing conductive bumps, forms a conductive channel and thereby forms an electrical connection between the circuit boards.
REFERENCES:
patent: 5323060 (1994-06-01), Fogal et al.
patent: 6020629 (2000-02-01), Farnworth et al.
Chang Chia-Wei
Hsu Shih-Ping
Lien Chung-Cheng
Nguyen Cuong Q
Phoenix Precision Technology Corporation
Sawyer Law Group P.C.
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