Stack type flip-chip package

Details Stack type flip-chip package Stack type flip-chip package

2006-04-25

2006-04-25

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S712000, C257S778000, C257S796000

Reexamination Certificate

active

07034388

ABSTRACT:
A stack type flip-chip package is described, including a substrate board, a first chip, a second chip, a packaging material and a heat sink. The substrate board has bump contacts and line contacts thereon, wherein the bump contacts connect with the bonding pads on the active surface of the first chip via bumps. The back surface of the first chip has a redistribution circuit thereon including bump pads and line pads exposed by a passivation layer, wherein the bump pads connect with the bonding pads of the second chip via bumps, and the line pads are connected to the line contacts via conductive wires. The packaging material encloses the first chip and the conductive wires, but may expose the back surface of the second chip, to which a heat sink can be directly bonded.

REFERENCES:
patent: 5994166 (1999-11-01), Akram et al.
patent: 6404062 (2002-06-01), Taniguchi et al.
patent: 6563206 (2003-05-01), Kamikuri et al.
patent: 6577008 (2003-06-01), Lam et al.

Affiliated with

Also associated with

Rating

Stack type flip-chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stack type flip-chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stack type flip-chip package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3591424